OUTER ELECTRONIC TECHNOLOGY (HK) LIMITED

Hontai Machinery and equipment (HK) Co. ltd God helps those who help themselves, Creative and progressive,Being honest.

Manufacturer from China
Verified Supplier
14 Years
Home / Products / IGBT Power Module /

BG770A-SN Satellite Communication Module High Performance Low Latency Wireless Solution

Contact Now
OUTER ELECTRONIC TECHNOLOGY (HK) LIMITED
Visit Website
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsBiona
Contact Now

BG770A-SN Satellite Communication Module High Performance Low Latency Wireless Solution

Ask Latest Price
Video Channel
Brand Name :Quectel
Model Number :BG770A-SN
Place of Origin :China
Price :Negotiations
Packaging Details :New original box
LGA form factor :14.9 mm ×12.9 mm ×1.9 mm
Extended temperature of :-40 °C to +85 °C
Contact Now

Add to Cart

Find Similar Videos
View Product Description

BG770A-SN Satellite Communication Module High Performance Low Latency Wireless Solution

Key features

Extremely compact LTE Cat M1/ NB1/ NB2/ NB-IoT NTN module with ultra-low power consumption

Global coverage over the GEO constellation

Super slim profile in LGA package

Embedded with abundant internet service protocols

Supports DFOTA

A rich set of external interfaces (including RF control interfaces) that ensure convenient applications

Fast time-to-market: reference designs, evaluation tools and timely technical support minimize time and efforts in design and development

Overview

BG770A-SN is a 5G-ready ultra-compact satellite communication module compliant with 3GPP E-UTRA release 13/ 14/ 17. The module supports LTE Cat M1, LTE Cat NB1/ NB2 bands, and NTN over NB-IoT. Additionally, it features ultra-low power consumption implemented by an MIPS 5150 processor and integrated RAM and flash, which help reduce current consumption to low levels in various modes, including PSM, e-I-DRX, etc. It is further integrated with a GNSS engine that supports GPS and GLONASS systems.

BG770A-SN boasts a comprehensive hardware-based security feature – integrated security elements (ISE). With an ultra-compact SMT form factor of 14.9 mm × 12.9 mm ×1.9 mm and a high integration level, the module enables integrators and developers to design applications easily, leveraging its low power consumption and compact structure design. The BG770A-SN’s advanced LGA package allows for the fully automated manufacturing required for large-scale applications.

A rich set of internet protocols, industry-standard interfaces and abundant functionalities extend the applicability of the module to a wide range of M2M applications, such as wireless POS, smart metering, tracking, wearable devices, and many more.

Inquiry Cart 0